4/10/2014, Las Vegas, NV


Henkel's latest solder and thermal management solutions take home top honors

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Henkel Electronics wins awards for new product innovations

The Electronics Group of Henkel won two New Product Innovation (NPI) Awards at the APEX event in Las Vegas in late March. APEX is a major technical conference and exhibition for the electronics manufacturing industry. The Electronics Group won for both its high-reliability solder system – LOCTITE MULTICORE HF 212 flux medium and 90iSC alloy – and LOCTITE TAF 8800 thermal absorbent film.

Hosted by Circuits Assembly magazine, the NPI Awards evaluate competitive products against one another using very stringent criteria that assess innovation, compatibility, cost effectiveness, design, speed/throughput improvements, ease of use, and maintainability and reparability. The Henkel materials solutions emerged as clear winners in the categories of solder materials and adhesives.

“Winning one NPI Award is validation enough, but earning two such prestigious prizes in a single year is rare and incredibly gratifying,” said Henkel Electronics Global Marketing Director Doug Dixon. “These honors just serve to further illustrate Henkel’s commitment to innovation and development of meaningful materials that advance modern electronics products.”