Recognized worldwide as the top brand for adhesives, films and underfills for semiconductor packaging and microassembly applications, Ablestik™ products are the preferred choice of leading, global packaging firms.

Our broad range of materials includes conductive and non-conductive adhesives, electrically conductive and insulating films, thermally conductive films, wafer-level underfills and die attach pastes and films. Used in numerous applications within several market segments, Ablestik materials provide cost-effective solutions for today’s most demanding packaging requirements.


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> To obtain an Ablestik Material Safety Data Sheet, call 1-978-436-9700.

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