Recognized worldwide as the top brand for adhesives, films and underfills for semiconductor packaging and microassembly applications, Ablestik™ products are the preferred choice of leading, global packaging firms.
Our broad range of materials includes conductive and non-conductive adhesives, electrically conductive and insulating films, thermally conductive films, wafer-level underfills and die attach pastes and films. Used in numerous applications within several market segments, Ablestik materials provide cost-effective solutions for today’s most demanding packaging requirements.
> To obtain an Ablestik Material Safety Data Sheet, call 1-978-436-9700.
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> For additional information about our Ablestik brand products, please visit our new Electronics Website @ electronics.henkel.com.